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1/17 www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. power supply ics for tft-lcd panels multi-channel system power supply ic for small to middle panel BD8184MUV ? description the BD8184MUV is a system power supply for the tft-lcd panels used for liquid crystal monitors and note display. incorporates high-power fet with low on resistance for large currents that employ high-power packages, thus driving large current loads while suppressing the generation of heat. a charge pump controller is incorporated as well, thus greatly reducing the number of application components. also gate shading function is included. ? features 1) boost dc/dc converter; 18 v / 2.5 a sw itch current. (target specification is 1% accurate.) 2) switching frequency: 1.2 mhz 3) operational amplifie r (short current 200ma) 4) incorporates positive / negative charge-pump controllers. 5) gate shading function 6) vqfn024v4040 package (4.0 mm x 4.0 mm) 7) protection circuits: under voltage lockout protection circuit thermal shutdown circuit (latch mode) over current protection circuit (avdd) timer latch mode short circuit protection (avdd src vgl) over / under voltage protection circuit for boost dc/dc output no scp time included (160ms from uvlo-off) ? applications power supply for the tft-lcd panels used for lcd monitors and note display no.11035eat18
technical note 2/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. absolute maximum ratings (t a = 25 ) parameter symbol limit unit supply voltage 1 vin +7 v supply voltage 2 avdd +20 v supply voltage 3 src +36 v switching voltage sw, drp, drn +20 v input voltage 1 rstin, dly, ctl, fb, fbp, fbn vin+0.3 v input voltage 2 inn, inp +20 v output voltage 1 rst, comp, vref +7 v output voltage 2 vcom +20 v output voltage 3_1 gsout +36 v output voltage 3_2 src - gsout +40 v junction temperature tjmax 150 power dissipation pd 3560 *1 mw operating temperature range topr -40 85 storage temperature range tstg -55 150 *1 derating in done 28.5mw/ for operating above ta R 25 (on 4-layer 74.2mm 74.2mm 1.6mm board) operating range (ta=-40 85 ) parameter symbol min max unit supply voltage 1 vin 2.0 5.5 v supply voltage 2 avdd 6 18 v supply voltage 3 src 12 34 v
technical note 3/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. electrical characteristics (unless otherwise specified vin = 3.3v, avdd = 10v and ta=25 ) parameter symbol limits unit condition min typ max general circuit current i vin - 1.2 3 ma no switching under voltage lockout threshold v uvlo 1.75 1.85 1.95 v vin rising internal reference output voltage vref 1.238 1.250 1.262 v no laod thermal shutdown (rising) tsd - 160 - junction temp duration to trigger fault condition t scp - 55 - ms fb , fbp or fbn below threshold boost converter (avdd) fb regulation voltage v fb 1.238 1.250 1.262 v voltage follower fb fault trip level v tl_fb 0.95 1.0 1.05 v vfb falling fb input bias current i fb - 0.1 1 a vfb= 1.5v sw leakage current i sw_l - 0 10 a vsw=20v maximum switching duty cycle m duty 85 90 95 % vfb= 1.0v sw on-resistance r sw - 200 - m isw= 200ma sw current limit i swlim 2.5 - - a over voltage protection v ovp - 20 - v avdd rising under voltage protection v uvp 1.3 1.6 1.9 v avdd falling boost soft start time t ss_fb - 13.6 - ms oscillator frequency f sw 1.0 1.2 1.4 mhz reset rst output low voltage v rst - 0.05 0.2 v irst =1.2ma rstin threshold voltage v th_l 1.18 1.25 1.32 v rstin falling rstin input current i rstin - 0 - a vrstin=0 to vin-0.3 rst blanking time t no_scp 146 163 180 ms no scp zone operational amp rifer input range v range 0 - avdd v offset voltage v os - 2 15 mv vinp= 5.0v input current i inp - 0 - a vinp= 5.0v output swing voltage (vinp= 5.0v) v oh - 5.03 5.06 v icom = +50ma v ol 4.94 4.97 - v icom = -50ma short circuit current i sht_vcom - 200 - ma slew rate sr - 40 - v/us
technical note 4/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. electrical characteristics (unless otherwise specified vin = 3.3v, avdd = 10v and t a =25 ) (continued) parameter symbol limits unit condition min typ max negative charge pump driver (vgl) fbn regulation voltage v fbn 235 250 265 mv fbn fault trip level v tl_fbn 400 450 500 mv v fbn rising fbn input bias current i fbn - 0.1 1 a v fbn = 0.1v oscillator frequency f cpn 500 600 700 khz drn leakage current i drn_l - 0 10 a v fbn =1.0v positive charge pump driver (src) fbp regulation voltage v fbp 1.23 1.25 1.27 v fbp fault trip level v tl_fbp 0.95 1.0 1.05 v v fbp falling fbp input bias current i fbp - 0.1 1 a v fbp = 1.5v oscillator frequency f cpp 500 600 700 khz drp leakage current i drp_l - 0 10 a v fbp = 1.5v soft-start time t ssp - 3.4 - ms gate shading function (gsout) dly source current i dly 4 5 6 a dly threshold voltage v tl_dly 1.22 1.25 1.28 v v dly falling ctl input voltage high v in_h 2.0 - - v ctl input voltage low v in_l - - 0.5 v ctl input bias current i ctl - 0 - a vrstin=0 to vin-0.3 propagation delay time (rising) t gs_r - 100 - ns v src = 25v propagation delay time (falling) t gs_f - 100 - ns v src = 25v src -gsout on resistance r gs_h - 15 - v dly = 1.5v gsout-re on resistance r gs_m - 30 - v dly = 1.5v gsout-gnd on resistance r gs_l - 2.5 - k v dly = 1.0v this product is not designed for protection against radio active rays.
technical note 5/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. fig.1 curcuit current (no switching) electrical characteristic curves (reference data) (unless otherwise specified vin = 3.3v, avdd = 10v and t a =25 ) fig.2 curcuit current (switching) fig.3 dependent on temparactue freqency fig.4 dependent on input voltage freqency fig.5 vref line regulation fig.6 vref load regulation 0.0 0.4 0.8 1.2 1.6 2.0 012345 vin [v] ivin [ma] 85 25 -40 1.00 1.10 1.20 1.30 1.40 -40 -15 10 35 60 85 ta [] fsw [mhz] 1.00 1.10 1.20 1.30 1.40 22.533.544.555.5 vin [v] fsw [mhz] 1.20 1.21 1.22 1.23 1.24 1.25 1.26 1.27 1.28 1.29 1.30 22.533.544.555.5 vin [v] vref [v] 85 25 -40 fig.12 boost converter efficiency 60 70 80 90 100 0 100 200 300 400 500 iavdd [ma] efficiency [%] vin=3.3v avdd=9.8v fsw=1.177mhz vgh,vglnoload fig.8 comp sink current -10 -6 -2 2 6 10 012 3 vcomp [v] icomp [ua] fig.9 comp source current -10 -6 -2 2 6 10 012 3 vcomp [v] icomp [ua] 0 5 10 15 20 25 30 35 40 45 50 012345 vin [v] ivin [ma] 85 25 -40 fig.7 comp v.s.cduty 0 20 40 60 80 100 0123 vcomp [v] duty [%] 85 25 -40 fig.10 load transient response falling iavdd avdd fig.11 load transient response rising iavdd avdd 1.15 1.20 1.25 1.30 0 5 10 15 20 25 30 ivref[ma] vref [v] 85 25 -40
technical note 6/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. electrical characteristic curves (reference data) ? continued (unless otherwise specified vin = 3.3v, avdd = 10v and t a =25 ) fig.18 power on sequence1 (main output) fig.19 power on sequence2 (ctl=signal, re pull down to avdd) fig.17 gate sharding wave form2 fig.21 power off sequence2 (r_rst_u=10k,r_rst_d=open) fig. 16 gate sharding wave form1 fig.20 power off sequence1 (r_rst_u=10k,r_rst_d=10k) 0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10 c_dly [uf] dly time [s] fig.13 vcom slew rate rising fig.14 vcom slew rate falling fig.15 c_dly vs. delay time vinp inn=vcom vinp inn=vcom ctl ctl gsout ( re p ull down to gnd ) gsout ( re p ull down to avdd ) vin avdd src vgl vin dly gsout ctl vin src gsout avdd rst vin src gsout avdd rst fig.22 power on sequence3 (main output) vin avdd src vgl
technical note 7/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. block diagram pin configuration fig.24 pin configuration fig.23 block diagram package dimension fig.25 package dimension (unit : mm) (unit : mm) vqfn024v4040 0.08 s s 16 7 12 19 24 13 18 0.4 0.1 0.02 +0.03 - 0.02 1pin mark 2.4 0.1 c0.2 0.5 4.0 0.1 0.75 2.4 0.1 4.0 0.1 1.0max (0.22) 0.25 +0.05 - 0.04 23 22 21 20 19 1 2 3 4 5 6 18 17 16 15 14 13 BD8184MUV dly src gsout re sw pgnd drn ctl rst fbp fbn vref inp inn vcom agnd1 avdd drp pgnd fb comp rstin agnd2 vin 7 8 9 10 11 12 reference voltage fall/thermal control digital control block current sense and limit sequence control negative charge pump oscillator high voltage switch control positive charge pump vin 0.25v (1.25v) vref 12 17 16 2 10 1 24 8 15 22 21 20 7 18 5 6 3 9 23 4 14 13 160ms 19 11 fall 1.25v fb error amplifier comparator sw pgnd avdd avdd avdd agnd1 agnd1 drn drp vcom agnd1 src rst agnd2 1.25v avdd 1.25v 0.25v comp fbn fbp inn inp dly ctl re gsout rstin pgnd lot d8184 marking 24 2 3 23
technical note 8/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. pin assignments pinno. pin name function 1 inp com amplifier input + 2 inn com amplifier input - 3 vcom com amplifier output 4 agnd1 ground 5 avdd supply voltage input for com, charge pump 6 drp drive pin of the positive charge pump 7 drn drive pin of the negative charge pump 8 ctl high voltage switch control pin 9 rst open drain reset output 10 fbp positive charge pump feed back 11 fbn negative ch arge pump feed back 12 vref internal reference voltage output 13 vin supply voltage input for pwm 14 agnd2 ground 15 rstin reset comparator input 16 comp boost amplifier output 17 fb boost amplifier input 18 pgnd1 boost fet ground 19 pgnd2 boost fet ground 20 sw boost fet drain 21 re gate high voltage fall set pin 22 gsout gate high voltage output set pin 23 src gate high voltage input set pin 24 dly gsout delay adjust pin
technical note 9/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. main block function ? boost converter a controller circuit for dc/dc boosting. the switching duty is controlled so that the feedback voltage fb is set to 1.25 v (typ.). a soft start operates at the time of starting. ? positive charge pump a controller circuit for the positive-side charge pump. the switching amplitude is controlled so that t he feedback voltage fbp will be set to 1.25 v (typ.). ? negative charge pump a controller circuit for the negative-side charge pump. the switching amplitude is controlled so that t he feedback voltage fbn will be set to 0.25 v (typ.). ? gate shading controller a controller circuit for p-mos fet switch the gsout switching synchronize with ctl input. when vin drops below uvlo threshold or rst=lo w(=rstin<1.25v), gsout is pulled high(=src). ? vcom a 1-channel operational amplifier block. ? reset a open-drain output(rst) refer from rstin voltage(up to threshold voltage 1.25v) rst is keep high(need a pull-up resistor connect ed to vin) dulling to 163ms from start-up. ? vref a block that generates internal reference voltage of 1.25v (typ.). vref is keep high when the thermal/shor t-current-protection shutdown circuit. ? tsd/uvlo/ovp/uvp the thermal shutdown circuit is shut down at an ic internal temperature of 160 . the under-voltage lockout protection circuit shuts down the ic when the vin is 1.85 v (typ.) or below. the over-voltage protection circuit when the sw is 19 v (typ.) or over. the under-voltage protection circuit when the sw is 1.3 v (typ.) or under ? start-up controller a control circuit for the starting sequence. controls to start in order of v cc ? v gl ? v dd ? s rc (please refer to fig.4 of next page for details.)
technical note 10/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. power sequence fig.26 power sequence
technical note 11/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. here, f is the switching frequency. [v] how to select parts of application (1-1) setting the output l constant (boost converter) the coil to use for output is decided by the rating current i lr and input current maximum value i inmax of the coil. adjust so that i inmax + ? i l does not reach the rating current value i lr . at this time, ? i l can be obtained by the following equation. ? i l = 1 v in ? v dd -v in ? 1 l v in f set with sufficient margin because the coil value may have the dispersion of ? 30%. if the coil current exceeds the rating current i lr of the coil, it may damage the ic internal element. bd8164muv uses the current mode dc/dc converter control and has the optimiz ed design at the coil value. a coil inductance (l) of 4.7 uh to 15 uh is recommended from viewpoints of electric power efficiency, response, and stability. (2) output capacity settings for the capacitor to use for the output, select the capaci tor which has the larger value in the ripple voltage v pp allowance value and the drop voltage allowance value at t he time of sudden load change. output ripple voltage is decided by the following equation. perform setting so that the voltage is within the allowable ripple voltage range. for the drop voltage during sudden load change; v dr , please perform the rough calculation by the following equation. v dr = ? i ? 10 us [v] co however, 10 ? s is the rough calculation value of the dc/dc response speed. please set the capacitance considering the sufficient margin so that these two values are within the standard value range. (3) selecting the input capacitor since the peak current flows between the in put and output at the dc/dc c onverter, a capacitor is required to install at the input side. for the reason, the low esr capacitor is recommended as an input capacitor which has the value more than 10 ? f and less than 100 m ? . if a capacitor out of this range is se lected, the excessive ripple voltage is superposed on the input voltage, accordin gly it may cause the malfunction of ic. however these conditions may vary according to the load current, input voltage, out put voltage, inductance and switching frequency. be sure to perform the margin check using the actual product. ? v pp = i lmax ? r esr + 1 ? v in ? (i lmax - ? i l ) fco avdd 2 il i inmax + ? i l should not reach the rating value level ilr [a] here, f is the switching frequency. fig.27 coil current waveform l v in i l v dd co fig. 28 output application circuit diagram i inmax average current
technical note 12/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. (4) setting r c , c c of the phase compensation circuit in the current mode control, since the co il current is controlled, a pole (phase lag) made by the cr filter composed of the output capacitor and load resistor will be created in the low frequency range, and a zero (phase lead) by the output capacitor and esr of capacitor will be created in the high frequency range. in this case, to cancel the pole of the power amplifier, it is easy to compensate by adding the zero point with c c and r c to the output from the error amp as shown in the illustration. open loop gain characteristics pole at the power amplification stage when the output current reduces, the load resistance r o increases and the pole frequency lowers. error amp phase compensation characteristics zero at the power amplification stage when the output capacitor is set larger, the pole frequency lowers but the zero frequency will not change. (this is because the capacitor esr becomes 1/2 when the capacitor becomes 2 times.) it is possible to realize the stable feedback loop by canc eling the pole fp(min.), which is created by the output capacitor and load resistor, with cr zero compensation of the error amp as shown below. fz(amp.) = fp(min.) 1 = 1 2 ? ? rc ? cc 2 ? ? romax ? co 1 fp = 2 ? ? r o ? c o 1 fz(esr) = 2 ? ? e sr ? c o 1 fp(min) = 2 ? ? r omax ? c o [hz] ? at light load 1 fz(max) = 2 ? ? r omin ? c o [hz] ? at heavy load 1 fp(amp.) = 2 ? ? r c ? c c fp(min) fp(max) fz(esr) a 0 -90 0 gain [db] phase [deg] l out min l out max 0 0 a -90 gain [db] phase [deg] l rc cc cin v in gnd,pgnd sw comp co esr ro a vdd fig. 29 gain vs phase fig. 30 application circuit diagram [hz] [hz] [hz] [hz] v in
technical note 13/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. (5) design of the feedback resistor constant refer to the following equation to set the feedback resistor. as the setting range, 6.8 k ? to 330 k ? is recommended. if the resistor is set lower than a 6.8 k ? , it causes the reduction of power efficiency. if it is set more than 330 k ? , the offset voltage becomes larger by the input bias cu rrent 0.1 a(typ.) in the internal error amplifier. (6) positive-side charge pump settings the ic incorporates a charge pump controller, thus making it possible to generate stable gate voltage. the output voltage is determined by the follo wing formula. as the setting range, 6.8 k ? to 330 k ? is recommended. if the resistor is set lower than a 6.8k ? , it causes the reduction of power efficiency. if it is set more than 330 k ? , the offset voltage becomes larger by the input bias current 0.1 a (typ.) in the internal error amp. in order to prevent output voltage overshooting, add capacito r c3 in parallel with r3. the recommended capacitance is 1000 pf to 4700 pf. if a capacitor outside this range is inserted, the output voltage may oscillate. (7) negative-side charge pump settings this ic incorporates a charge pump controller for negative voltage, thus making it possible to generate stable gate voltage. the output voltage is determined by the follo wing formula. as the setting range, 6.8 k ? to 330 k ? is recommended. if the resistor is set lower than a 6.8 k ? , it causes the reduction of power ef ficiency. if it is set more than 330 k ? , the offset voltage becomes larger by the input bias current 0.1 a (typ.) in the internal error amp. in order to prevent output voltage overshoot ing, insert capacitor c5 in parallel with r5. the recommended capacitance is 1000 pf to 4700 pf. if a capacitor outside this range is inserted, the output voltage may oscillate. avdd = r1 + r2 ? fb [v] r2 src = r3 + r4 ? fbp [v] r4 v gl = (fbn vref) r5 + fbn [v] r6 fbp vo r1 r2 err reference voltage 1.25 v fb 17 vgl r5 r6 err fb n c5 1000 pf to 4700 pf 0.25v 11 vref (1.25v 1%) fig. 31 application circuit diagram src r3 r4 err reference voltage 1.25 v c3 1000 pf to 4700 pf fig. 32 application circuit diagram fig. 33 application circuit diagram 10 12
technical note 14/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. application circuit fig. 34 application circuit dly src gsout re sw pgnd pgnd fb comp rstin agnd2 vin drn ctl rst fbp fbn vref inp inn vcom agnd1 avdd drp src gsout 1k vin avdd 10v/0.5amax tdk slf7055t-100m2r5(10h,2.5a) vin 3.3v vgl -7.1v/20ma max ctl src vcom 5.5v rst rsx301la-30 10uf 10uf 10uf 10uf 10uf 91k 13k 3.9k 10nf 10k 10k 10k 1uf 110k 1uf 15k 0.22f 1uf 0.1uf 10k 150k 1uf 0.1uf 0.1uf 0.1uf 1uf 10 22k 18k 33nf avdd avdd da227 da227 da227 20v/20ma max 1 2 3 4 5 6 78 910 1112 18 17 16 15 14 13 24 23 22 21 20 19
technical note 15/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. i/o equivalent circuit diagrams (except for 4.agnd1, 5.av dd, 13.vin, 14.agnd2, 18 ? 19.pgnd, 23.src) 1.inp 2.inn 3.vcom 6.drp 7.drn 8.ctl 9.rst 10.fbp 11.fbn 15.rstin 16.comp 17.fb 18.sw 21.re 22.gsout 24.dly avdd avdd avdd avdd vin vin vin vin vin vin src vin src re
technical note 16/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. operation notes 1. absolute maximum range this product are produced with strict quality control, but might be destroyed in using beyond absolute maximum ratings. open ic destroyed a failure mode cannot be defined (like short mode, or open mode). therefore physical security countermeasure, like fuse, is to be given when a specified mode to be beyond absolute maximum ratings is considered. 2. about rush current rush current might flow momentarily by the order of turning on the power supply and rise time in ic with two or more power supplies. therefore, please note drawing the width of the power supply and the gnd pattern wiring, the output capaci ty, and the pattern and the current abilities. 3. setting of heat use a setting of heat that allows for a sufficient margin in light of the powe r dissipation (pd) in actual operating conditions. 4. short circuit between terminal and soldering don?t short-circuit between output pin and vin pin, output pin and gnd pin, or vin pin and gnd pin. when soldering the ic on circuit board, please be un usually cautious about t he orientation and the position of the ic. when the orientation is mistaken the ic may be destroyed. 5. electromagnetic field mal-function may happen when the device is used in the strong electromagnetic field. 6. ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's referenc e point so that the pattern wiring resistance and voltage variations caused by large currents do not c ause variations in the small signal ground voltage. be careful not to change the gnd wiring patterns of any external components. 7. this ic is a monolithic ic which has p+ isol ation in the p substrate and between the various pins. a p-n junction is formed from this p laye r and the n layer of each pi n. for example, when a resistor and a transistor is connected to a pin. parasitic diodes can occur inevitably in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits as well as operation faults and physical damage. accordingly, you must not use methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd. (p substrate) voltage to an input pin. please make sure al l pins which is over gnd even if include transient feature. 8. over current protection circuit the over-current protection circuits are built in at output, according to their respective current outputs and prevent the ic from being damaged when the load is short- circuited or over-current. but, these protection circuits are effective for preventing destructi on by unexpected accident. when it?s in continuous protection circuit moving period don?t use please. and for ability, because this ch ip has minus characteristic, be careful for heat plan. 9. built-in thermal circuit a temperature control circuit is built in the ic to prevent the damage due to overheat. therefore, all the outputs are turned off when the thermal circuit works and are turned on when the temperature goes down to the specified level. 10. testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capa citors after each process or step. ground the ic during assembly steps as an antistatic measure, and use similar caution when transporting or storing the ic. always turn the ic's power supply off before connec ting it to or removing it from a jig or fixture during the inspection process. parasitic diode resister pin? pin? parasitic diode or transistor gnd substrate gnd pin? parasitic diode gnd pin? near-by other element parasitic diode or transistor gnd simplified structure of bi-polar ic
technical note 17/17 BD8184MUV www.rohm.com 2011.11 - rev. a ? 2011 rohm co., ltd. all rights reserved. ordering part number b d 8 1 8 4 m u v - e 2 part no. part no. package muv:vqfn024v4040 packaging and forming specification e2: embossed tape and reel (unit : mm) vqfn024v4040 0.08 s s 16 7 12 19 24 13 18 0.4 0.1 0.02 +0.03 - 0.02 1pin mark 2.4 0.1 c0.2 0.5 4.0 0.1 0.75 2.4 0.1 4.0 0.1 1.0max (0.22) 0.25 +0.05 - 0.04 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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